| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate |
2011-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82da5b658bc1f4c90ea8b11dcb38cc30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117eb0bc8d343e99cfa8eeac629dd77e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb944b63694dc1de3d8f1105fdb321a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1622b52209c5a3a3ea4e67dc8fe3b54 |
| publicationDate |
2013-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130007656-A |
| titleOfInvention |
Package and light emitting device for semiconductor light emitting device |
| abstract |
An object of the present invention is to provide a package in which metal wirings and the like are not easily peeled from the package with respect to heat generation from the semiconductor light emitting element. A package for semiconductor light emitting devices, comprising at least a resin molded product containing polyorganosiloxane (A) containing SiH and a filler (B), wherein SiH in the resin molded product after heating the resin molded product at 200 ° C. for 10 minutes. The said subject was solved by the package for semiconductor light-emitting devices characterized by presence of 20-65 micromol / g. |
| priorityDate |
2010-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |