| abstract |
The present invention provides a photosensitive resin composition capable of forming a film having excellent properties such as solder heat resistance and gold plating resistance as well as excellent environmental resistance, low environmental load due to flame retardancy, low bending property and bending property. The photosensitive resin composition of this invention contains the photosensitive resin which has a structure represented by following General formula (1)-(3), a photoinitiator, aluminum hydroxide, and / or a phosphorus containing compound. (In formula (1), R < 1> represents group of following formula (2), R < 2> represents a methyl group or OR < 1> group, n + m = 1.5-6.0, n = 0-6.0, m = 0-6.0, l = 0 to 3, n: m = 100: 0 to 0: 100) (In formula (2), R < 3> represents hydrogen or a methyl group, R < 4> represents group or hydrogen of following formula (3), and k = 0.3-10.) (In formula (3), R 5 represents hydrogen or a methyl group.) |