| abstract |
The present invention provides a chip-on-film type semiconductor package that can obtain a high heat dissipation effect of the driver integrated circuit chip and can prevent lead breakage, and the chip-on-film type semiconductor package of the present invention includes a film; A plurality of leads formed on the film; A chip bonded onto the ends of the leads; An underfill layer filling the space between the chip and the lead and a graphite-based heat dissipation layer attached to the lower surface of the film. The graphite heat dissipation layer may have an ultra-thin thickness of 140 μm or less. In addition, the heat dissipation layer is excellent in flexibility and tensile force (Tensile force) by applying the graphite can be applied to a wider range of products of the flexible form. |