| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01e48e78fadaaec045333f9ad5a6e0b5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-332
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-0823
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-187 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J145-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-08 |
| filingDate |
2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9c3527415c0e9bc2772fe02186761d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08bad9c6cad8bf077116585a7084beaf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d034d4d2baa3c78c8078644afc41322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad180065d551c7be655d5e3854b47229 |
| publicationDate |
2012-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120115579-A |
| titleOfInvention |
Cyclic Olefin Compositions for Temporary Wafer Bonding |
| abstract |
Novel compositions and methods of using such compositions as binding compositions are provided. The composition comprises a cycloolefin copolymer dispersed or dissolved in a solvent system and can be used to bind the active wafer to a carrier wafer or substrate to help protect the active wafer and its active site during subsequent processing and handling. The composition is chemically and thermally resistant, but forms a bonding layer that can soften or dissolve to allow the wafer to slide or pull off at an appropriate stage of the fabrication process. |
| priorityDate |
2008-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |