| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2012-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c403aeb8534b229859c20d7a57c1b1b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_805c8023faf5b99603fd48ddcdedeb4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9b4e74a5786c6102777b0ca7534f310
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f74de609fa36253ccf171c3640beb6a7 |
| publicationDate |
2012-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120112047-A |
| titleOfInvention |
Connection method of anisotropic conductive paste and electronic component using same |
| abstract |
The anisotropic conductive paste of this invention is an anisotropic conductive paste which connects an electronic component and a wiring board. And the said anisotropic conductive paste contains 10 mass% or more and 50 mass% or less of the lead-free solder powder which has melting | fusing point of 240 degrees C or less, and 50 mass% or more and 90 mass% or less of the thermosetting resin composition containing a thermosetting resin and an organic acid, The acid value of the thermosetting resin composition is characterized by being 15 mgKOH / g or more and 55 mgKOH / g or less. |
| priorityDate |
2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |