http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120109613-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2011-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f39641f2b55f9083c199105f786d54c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_810d05d43df07db512a5aa62cbd2fd53 |
| publicationDate | 2012-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120109613-A |
| titleOfInvention | Laminated structure and the photosensitive dry film used for this |
| abstract | In the laminated structure which has at least the board | substrate 1 and the photosensitive resin layer or hardened film layer 2 containing the inorganic filler 3 formed on the said board | substrate, as long as possible the linear thermal expansion coefficient as a whole photosensitive resin layer or hardened film layer, Inorganic fillers in the photosensitive resin layer or the cured coating layer can be kept low and have no resolution deterioration, are excellent in adhesion between the photosensitive resin layer or the cured coating layer and the substrate, and do not cause peeling during the PCT or cold heat cycle. The side where the content ratio of a is in contact with the substrate is low, and the surface side far from the substrate is high. Preferably, the content ratio of the inorganic filler in the photosensitive resin layer or the cured coating layer is gradually inclined or gradually increased from the side in contact with the substrate toward the surface side away from the substrate. The photosensitive dry film which has the said photosensitive resin layer is used suitably as a soldering resist or an interlayer resin insulating layer of a printed wiring board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150061128-A |
| priorityDate | 2010-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 552.