| abstract |
The photocurable resin composition, the dry film, and these hardened | cured material which can form alkali, and can have hardened | cured material excellent in (wet) heat resistance and cold shock resistance while having excellent resolution, and these hardened | cured material It provides a printed wiring board using. The photocurable resin composition of this invention contains carboxyl group-containing resin, a photoinitiator, and the Neuburgh siliceous particle surface-treated. |