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filingDate 2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de1116c03680b61d51be47eacd05c6e1
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publicationDate 2012-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20120105132-A
titleOfInvention Molding method of LED power supply using two-component liquid silicone
abstract The present invention can effectively dissipate heat generated from the electrical and electronic components of the LED power supply to the outside by mixing the silica filled in the liquid silicon filled in the LED power supply to reduce the performance of the electrical and electronic components or frequent Problems such as failure can be greatly improved, and by using silica powder as a filler rather than using only liquid silicone and hardener, it provides a molding method of the LED power supply using a two-component liquid silicone that can lower the manufacturing cost.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017052107-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101461041-B1
priorityDate 2011-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.