http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120095879-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2010-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a613aaa12ae0a1b983570a3a60df9305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb2387a978f600c9bc835d3ebb30a4b4 |
| publicationDate | 2012-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120095879-A |
| titleOfInvention | Curable resin composition for optical semiconductor encapsulation, and its hardened | cured material |
| abstract | The present invention provides a polyfunctional biphenyl novolac epoxy resin component (A), a bisphenol epoxy resin (B) having an epoxy equivalent of 500 to 800 g / eq, a bisphenol epoxy resin (C) having an epoxy equivalent of 850 to 1500 g / eq, and a multi-pipe The curable resin composition for optical-semiconductor encapsulation containing a nitric acid anhydride hardening | curing agent component (D), a biphenyl skeleton or an alicyclic frame | skeleton containing phenolic hardening | curing agent component (E) and the (meth) acrylate component (F) which has a phosphoric acid group, The resin composition has excellent reactivity during transfer molding, short gel time, no void mixing, high hot hardness during demolding, excellent gate break resistance, and reflowability of the resulting encapsulated optical semiconductor device. It is also good. |
| priorityDate | 2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 258.