abstract |
The flux for one solder paste of the present invention is an acrylic resin obtained by radical copolymerization of a (meth) acrylic acid ester having an alkyl group of C 6 or more and C 15 or less with a (meth) acrylic acid ester other than its (meth) acrylic acid ester; In addition to rosin, at the same time, the weight ratio of the acrylic resin when the rosin is 1 is 0.5 or more and 1.2 or less and fluidized by giving a shear force of 10 Pa or more and 150 Pa or less. |