| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b03aca03f0f766d5a011469c59b6acdd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-22 |
| filingDate |
2011-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03a927d138c37c0841169416c3a43e1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_388175653d48c5ca1db08e09784efeca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edfc79c3f5832ab235a71595adec79ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7884f27582f4eb262ff47a9421106083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ff5ab4d10d1e7bd88d18a112882b6d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ba2329462ec15070fefdd0e82d32986
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b1da921fb3dc6578aea28e23cffca5e |
| publicationDate |
2012-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120078870-A |
| titleOfInvention |
Epoxy Resin Compositions Containing Polymer-Modified Nanoporous Particles and thereby Sealed Semiconductor Devices |
| abstract |
An epoxy resin composition containing polymer modified nanoporous particles and a semiconductor device sealed thereby are provided. The epoxy resin composition containing the polymer-modified nanoporous particles according to the present invention comprises 5 to 60 parts by weight of an epoxy resin; 10 to 60 parts by weight of butadiene acrylonitrile; 2 to 20 parts by weight of the curing agent; 0.2 to 5 parts by weight of a curing accelerator; 1 to 20 parts by weight of the polymer-modified nanoporous ion trapping agent; 0.5 to 5 parts by weight of the additive; And 10 to 50 parts by weight of an organic solvent, and the epoxy resin composition according to the present invention can effectively suppress the inter-element transfer of metal ions such as copper, while maintaining excellent adhesion even at high temperatures. Therefore, the semiconductor device sealed by the epoxy resin composition according to the present invention shows excellent reliability even at high temperatures. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150075387-A |
| priorityDate |
2011-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |