| abstract |
In the cutting process of a silicon ingot, since the present invention has superior lubricity than conventional products, cutting efficiency can be improved, and since flammable hydrogen generation due to reaction of water and silicon is suppressed, stability is excellent. In addition, since there are few bubbles, the water-soluble cutting liquid which does not cause a bubble etc. in circulation use is provided. Monovalent or divalent aliphatic carboxylic acid (A) having 4 to 10 carbon atoms (including carbon of carbonyl group), and polyvalent organic acid (B) having 0.9 to 2.3 of ΔpKa represented by the following formula (1) or the organic acid ( A water-soluble cutting fluid for silicon ingot slices, comprising the salt (BA) of B) as an essential component. ΔpKa = (pKa 2 )-(pKa 1 ) (1) However, the acid dissociation constant when the organic acid (B) having n basic acid H n A is H n -1 A + H + is 1, and the dissociation constant is pKa 1 ; H n -2 A + H + The acid dissociation constant when is set to 2 is represented by pKa 2 . |