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filingDate 2011-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20120060146-A
titleOfInvention Semiconductor chip, stacked semiconductor package and manufacturing method thereof
abstract The semiconductor package of the present invention includes a first semiconductor chip having one surface and the other surface opposite to one surface, a first test through electrode penetrating the other surface from one surface, and a first test through electrode electrically projecting to the other surface. It includes the conductive projections.
priorityDate 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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