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publicationDate 2012-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20120057517-A
titleOfInvention Silicate composite polishing pad
abstract The present invention provides a polishing pad useful for polishing at least one of a semiconductor substrate, a magnetic substrate, and an optical substrate. The polishing pad includes a polymer matrix having a polishing surface. Polymer microelements are distributed in the polymer matrix and on the polishing surface of the polymer matrix. The silicate containing regions distributed within each polymer microelement cover less than 50% of the outer surface of the polymer microelement. Less than 0.1% by weight of the total polymer microelements i) silicate particles having a particle size greater than 5 μm; ii) silicate containing regions covering more than 50% of the outer surface of the polymeric microelement; And iii) polymer microelements agglomerated with silicate particles with an average cluster size of greater than 120 μm.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180121840-A
priorityDate 2010-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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