| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f8877d26e7e712d48efb03a75bd073f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
2005-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d8c7145bc6967db9d4a5ed390461cb5 |
| publicationDate |
2012-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120051088-A |
| titleOfInvention |
Resin composition for sealing and resin-sealed semiconductor device |
| abstract |
The present invention relates to 100 parts by weight of a synthetic resin (A), 10 to 500 parts by weight of a carbon precursor (B) having a volume resistivity of 10 2 to 10 10 Ωcm, and a conductive filler (C) having a volume resistivity of less than 10 2 Ω? Cm. It provides the sealing resin composition containing -60 weight part and 100-1500 weight part of other inorganic fillers (D). |
| priorityDate |
2004-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |