http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120045323-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af0cf835415239518e4da08e3fe7304e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20509 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 2010-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a06f32d897b55909e87be4541ad33e37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21217153521a9becf5d6db73c787b900 |
| publicationDate | 2012-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120045323-A |
| titleOfInvention | Cooling board for heat dissipation of electronic parts and manufacturing method thereof |
| abstract | The present invention relates to a cooling substrate for heat dissipation of an electronic component and a method for manufacturing the same, wherein the first coating part is formed by spraying a coating material formed of powder on one surface of a heat dissipation part laminated on a substrate on which the electronic part is mounted, and the substrate. Heat dissipating heat of the electronic component conducted to the first coating part, and the heat dissipation part preparation step, the first coating part forming step and the second coating part are formed to include a heat dissipation part formed on one surface of the first coating part. Characterized by forming a cooling substrate through the step. |
| priorityDate | 2010-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.