| abstract |
The fluorine-containing polymer compound of the present invention is a resin having a mass average molecular weight of 1,000 to 1,000,000, including the repeating unit (a) represented by General Formula (2). The said resin can be used suitably for the resist composition which forms a pattern using the high energy ray or the electron beam of the wavelength of 300 nm or less, and the topcoat composition in immersion lithography, It is characterized by the high water repellency, especially the receding contact angle. do. [Formula 72] (Wherein R 1 represents a polymerizable double bond-containing group, R 2 represents a fluorine atom or a fluorine-containing alkyl group, R 8 represents a substituted or unsubstituted alkyl group, and the like, W 1 represents a single bond, an unsubstituted or substituted methylene) Group, etc.) |