| abstract |
A semiconductor package and a method of manufacturing the same are provided. In the semiconductor package and a method of manufacturing the same, at least one of the substrate insulating film and the chip insulating film includes a dummy opening, and the substrate connecting terminal and the chip connecting terminal are connected in a self-assembly solder bonding process for flip chip bonding. Solder particles remaining in the vicinity of the internal solder balls do not fill the dummy openings to form dummy solder. As a result, problems such as electrical shorts and leakage currents due to the remaining solder particles can be solved, thereby providing a reliable semiconductor package. In addition, since the dummy opening is formed to expose a predetermined portion of the circuit pattern, which is the signal transmission path, it is not necessary to intentionally form the dummy metal pattern, and there is no need to change the signal wiring design of the circuit board. |