abstract |
The resin composition for optical semiconductor sealing has an epoxy component containing triglycidyl isocyanurate, an acid anhydride type curing agent, and a weight average molecular weight of 20000? 65000, viscosity is 100? It contains a glycidyl-group-containing (meth) acrylic acid ester-type resin which is 10000 Pa's, and a hardening accelerator, and has a viscosity of 10? 200 μs, and the thixotropic index is 3? 15 is. |