| abstract |
Provided are a method for producing a metal clad laminate and a metal clad laminate, which can simultaneously realize an improvement in adhesion between a thermoplastic film as a substrate and a metal layer, an improvement in the deposition rate of a plated film on a substrate, and an optimum of an insulation resistance after etching. A metal clad laminate comprising a substrate made of a thermoplastic polymer film, an underlying metal layer formed on the surface of the substrate, and an upper metal layer formed on the surface of the underlying metal layer, wherein the underlying metal layer contains 0.05 to 0.21 mass% of phosphorus. The upper metal layer is formed of copper or a copper alloy. |