| abstract |
This invention provides the photosensitive resin composition which is excellent in developability and excellent in adhesiveness to a board | substrate after baking, and adhesiveness between layers in baking material pattern formation. The photosensitive resin composition of this invention contains an inorganic fine particle, carboxyl group-containing resin, a propyl oxide modified trimethylol alkane tri (meth) acrylate, and a photopolymerization monomer. |