http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120031990-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32 |
| filingDate | 2012-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47c22587224758fcbe1a884217a4eeaa |
| publicationDate | 2012-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120031990-A |
| titleOfInvention | Electroless Gold Plating & Methods |
| abstract | According to the present invention there is provided an electroless gold plating bath and a plating method using the same. Electroless gold plating baths include i) water soluble gold compounds, ii) complexing agents that stabilize gold ions in the plating bath but do not dissolve a significant amount of nickel, cobalt or palladium in the plating bath, and iii) polyethyleneimine compounds. When the material to be plated is applied to the gold plating bath, the substitution reaction rate is controlled immediately after the start of the reaction to reduce corrosion of the base metal below the surface of the material to be plated, and increase adhesion between the base metal and the deposited gold coating. |
| priorityDate | 2001-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.