| abstract |
Bonding directly to a first wafer 100 having a unique curvature before bonding to a second wafer 200 having a unique curvature before bonding, wherein at least one of the two wafers 100 is of at least one family Micro components 110. The method includes at least one step of bringing the two wafers 100, 200 into contact with each other so that the transfer of a bonding wave between the two wafers begins. During the contacting step, a predefined bonding curvature in the form of a rotating parabolic surface, depending on the inherent curvature K1 of the wafer 100 comprising one series of microcomponents 110 before bonding. (KB) is imposed on one of the two wafers, and the other wafer is free so as to match the predefined bonding curvature (KB). |