| abstract |
The mounting structure of the chip of this invention consists of a board | substrate which has a base, the 1st chip arrange | positioned at the upper surface side of the said base, and the adhesive agent for adhere | attaching the said 1st chip to the said base. The adhesive is disposed on the upper surface of the base. The first chip is formed in a rectangular shape, has a width and a length, and a lower surface thereof is adhered to the base by the adhesive. The adhesive consists of only the first adhesive, the second adhesive and the third adhesive, which are arranged only in three spots on the upper surface of the base, and the three spots on the upper surface of the base are arranged at the vertices of the triangle. The first chip is bonded to the base using only the first adhesive, the second adhesive, and the third adhesive. |