| abstract |
An object of the present invention is a photosensitive resin composition, an adhesive film made of a photosensitive resin composition, and a light receiving device formed of an adhesive film, wherein the resin residue after patterning by exposure and development is small, and the semiconductor wafer and the transparent material are kept in an environment of high temperature and high humidity. It is providing the photosensitive resin composition, the adhesive film, and the light receiving apparatus which can reduce the dew condensation which arises between board | substrates. The photosensitive resin composition of this invention contains compound (C) which has alkali-soluble resin (A), a photoinitiator (B), and a phenolic hydroxyl group and a carboxyl group. |