abstract |
The present invention provides a photocurable thermosetting resin composition, a dry film, and a hard film having excellent insulation reliability, chemical resistance, and capable of forming a cured film having PCT resistance, HAST resistance, and electroless gold plating resistance, which are important as solder resists for semiconductor packages. A printed wiring board in which a cured film such as a solder and a solder resist is formed by these products is provided. The photocurable thermosetting resin composition which can be developed by the aqueous alkali solution contains a carboxyl group-containing resin (except carboxyl group-containing resin which uses epoxy resin as a starting material), a photoinitiator, and the amino resin which has an alkoxy methyl group. It is preferable that the said carboxyl group-containing resin does not contain a hydroxyl group, and it is more preferable to have a photosensitive group. In a preferred embodiment, the photocurable thermosetting resin composition further contains a thermosetting component, and preferably further contains a colorant. |