| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cf090b996cdebbe10a9b68e50efa620
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9210ada95a4d1ae1eb884706d377f3f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7460dd2c5be4032adebd99ab00569cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d454dea0e262df486e97f1a3a5034d70 |
| publicationDate |
2012-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120022810-A |
| titleOfInvention |
Fabrication of Multilayer Printed Circuit Boards |
| abstract |
The present invention relates to a process for the production of multilayer printed circuit boards and articles formed thereby, in particular IC substrates. The process of the present invention utilizes inorganic silicate and organosilane bonding mixtures in separate process steps to provide adhesion between the layers of dielectric material and copper. The process improves mechanical and thermal stress resistance as well as moisture resistance of multilayer printed circuit boards and IC substrates, and improves adhesive strength. |
| priorityDate |
2009-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |