| abstract |
The present invention relates to laminated packages that can be used in three-dimensional system-in-package (SIP). The stack package includes a first semiconductor chip, a second semiconductor chip, and a support member. The first semiconductor chip has a through electrode. The second semiconductor chip is stacked on the top surface of the first semiconductor chip, and is electrically connected to the first semiconductor chip through the through electrode of the first semiconductor chip. The support member is attached on the upper surface of the first semiconductor chip spaced apart from the edge of the second semiconductor chip. |