http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120009807-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3bf98aa6d4de2752f2f6fac638dc2cd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 2010-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edff9734b3de12bd910861ba8ba38c9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0b7cb3c84b68632bb83a932255d1797 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b23b49d2b44af962bd40b50d28de360b |
| publicationDate | 2012-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120009807-A |
| titleOfInvention | Adhesive composition with improved heat resistance and adhesive sheet for attaching flexible circuit board reinforcement plate using same |
| abstract | The present invention relates to an adhesive composition having improved heat resistance and an adhesive sheet for attaching a flexible circuit board reinforcement plate using the same. The adhesive composition of the present invention is a polyurethane urea resin (A), an epoxy curing agent (B) prepared by the reaction of a urethane-based prepolymer having an isocyanate end group and an amine compound, more preferably a monoamine or diamine compound having a high reaction rate, and As a phenol curing agent (C) is contained, an adhesive sheet for attaching a flexible circuit board reinforcement plate or a heat sink using the adhesive composition may be provided. The adhesive sheet of the present invention maintains long-term storage like an acrylic adhesive under soaking conditions, has excellent adhesion with a flexible circuit board reinforcement plate, and improves solder heat resistance to cope with lead-free solder reflow process temperatures. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140048543-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101316685-B1 |
| priorityDate | 2010-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.