http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120005498-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0955bf8807610e8f0af72b9758aa4891 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate | 2010-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b47aefe3d6a4ee663555444f90e5c2ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe07d8533c429eabfcef101ac6a76a3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fe300ee820e965e8a5ca68b8f842b5c |
| publicationDate | 2012-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20120005498-A |
| titleOfInvention | Electroless Palladium Plating Solution |
| abstract | The present invention provides an electroless palladium plating solution capable of forming a plating layer having excellent solder bonding and wire bonding properties to electronic components and the like. In an electroless palladium plating solution containing a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, a hypophosphorous acid or hypophosphorous acid compound and a formic acid compound or a formic acid compound are used together as the reducing agent, and the palladium compound 0.001 to 0.1 mol / 1, the said amine compound is 0.05-5 mol / 1, the said inorganic sulfur compound 0.01-0.1 mol / 1, the said hypophosphorous acid compound is 0.05-1.0 mol / 1, the said formic acid or formic acid compound is 0.001-0.1 mol / 1, Thereby, the electroless palladium plating liquid characterized by obtaining the plating liquid excellent in the soldering characteristic and the wire bonding characteristic. |
| priorityDate | 2009-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.