| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2011-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f825d7069eae5b599e281993d23a3533
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8116b09a4c548bd6b39dca4853cc226f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9f9ddc0a600a733a06ad39f88657400 |
| publicationDate |
2011-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110139105-A |
| titleOfInvention |
Substrate with metal fine pattern, printed wiring board and semiconductor device, and manufacturing method of base with metal fine pattern and printed wiring board |
| abstract |
Metal fine which can suppress abnormal deposition of metal on the underlying resin surface when electroless nickel-palladium-gold plating is performed on the surface of the metal fine pattern provided on the substrate as in the terminal portion of the printed wiring board. Provided are a method for producing a substrate with a pattern, and a substrate with a metal fine pattern, a printed wiring board, and a semiconductor device having a plated surface excellent in quality by the above production method. Embedding a lower portion of the metal fine pattern in a groove provided on a support surface made of a base resin, and performing electroless nickel-palladium-gold plating on a portion not in contact with the surface of the groove of the metal fine pattern; The manufacturing method of the base material with a metal micropattern so that ratio (X / Y) of the protrusion height X from the support surface and the minimum distance Y between patterns in the said plating area | region may be less than 0.8. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101410395-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101484938-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11282802-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10475758-B2 |
| priorityDate |
2010-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |