| abstract |
Aspects of the present invention provide an electrically conductive thermosetting composition for use in surface films and adhesives. The surface film retains improved electrical conductivity similar to metal without the use of embedded metal bodies or foils. Such surface films can be incorporated into composite structures (eg, prepregs, tapes, and fabrics), for example by outer hardening, as the outermost surface layer. In particular, compositions prepared using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, a composition comprising at least 45 wt% silver flakes exhibits a resistivity of less than about 55 mΩ / sq. In this way, the surface film as the outermost conductive layer can provide lightning protection (LSP) and electromagnetic interference (EMI) shielding effects when used in applications such as aircraft components. |