| abstract |
In the flip chip bonding method of the present invention, in a flip chip bonding method of bonding a chip having a bump formed on one surface thereof by electrically connecting the substrate, applying an adhesive on the substrate, the adhesive on the adhesive Transferring the chip to position and bonding the bumps onto the substrate by applying heat and pressure to the other side of the chip, wherein the adhesive is cured at the point of complete curing from the start of curing, the instant at which curing begins. In the process of curing to reach the completion point, it has the property of curing faster than the early stage. |