| abstract |
[assignment] In a resin composition suitable for forming an insulating layer of a circuit board, it is to provide a resin composition capable of forming a conductor layer having a high peel strength even when the roughness of the surface of the insulating layer obtained by curing the resin composition is low. [Workaround] Resin composition containing (A) polyfunctional epoxy resin, (B) phenolic hardening | curing agent and / or active ester-type hardening | curing agent, (C) thermoplastic resin, (D) inorganic filler, and (E) specific hardening accelerator. |