| abstract |
The present invention relates to an adhesive composition comprising (a) an epoxy resin, (b) a curing agent, and (c) a polymer compound incompatible with the epoxy resin and optionally comprising (d) a filler and / or (e) a curing accelerator; a method of producing an adhesive composition comprising mixing (a) an epoxy resin and (b) a curing agent and (d) a filler, and then mixing (c) an epoxy resin and an incompatible high molecular compound into their mixture; An adhesive film formed by forming the adhesive composition into a film; A semiconductor mounting substrate comprising the adhesive film on a chip mounting surface of a wiring board; And Disclosed is a semiconductor device using the adhesive film or the semiconductor mounting substrate. |