| abstract |
The present invention includes (A) a divalent or higher inorganic acid, (B) amino acid, (C) protective film former, (D) abrasive grain, (E) oxidizing agent, and (F) water, (A) component The content of is 0.08 mol / kg or more, the content of the component (B) is 0.20 mol / kg or more, the content of the component (C) is 0.02 mol / kg or more, and at least one of the following (i) and (ii) Provided are abrasive polishing abrasives. (i) The ratio of content of the said (A) component with respect to content of (C) component is 2.00 or more. (ii) (G) further contains at least one selected from organic acids and acid anhydrides thereof. |