| abstract |
The present invention relates to a novel epoxy resin having excellent hygroscopicity and crystallinity and low melt viscosity in which two symmetric naphthalene structures are connected to an alkanediyl structure, and an epoxy resin composite for semiconductor encapsulation comprising the same. According to the present invention, the epoxy resin of the formula (3); And an epoxy resin composite for semiconductor encapsulation, comprising an epoxy resin of Formula 3, an inorganic filler, and a curing agent. (3) Where A is [Formula 4-1] or [Formula 4-2] (Wherein R is a single bond or a C1 to C5 alkanediyl group), and n is an integer of 1 to 10. The epoxy resin composite for semiconductor encapsulation has excellent hygroscopicity and low melting point. Having a degree of crystallinity and room temperature, processability and reliability of a product are improved when encapsulating a semiconductor device. |