| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9328c4afc980b21015f5165d1c4c1f01 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2010-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed8bfbec63a1f002babe3181efa9ded2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f56f6213eac823a320657557b8e6ab1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c285c002b729d133abfd7bde37a7c685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb3bed835a3f8b446b1f4c5b71770f82 |
| publicationDate |
2011-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110090756-A |
| titleOfInvention |
A method for producing a conductive adhesive composition for a circuit connection, a circuit connection material, a circuit connection structure and a circuit connection structure |
| abstract |
This invention relates to the electrically conductive adhesive composition for circuit connection, Comprising: It provides the electrically conductive adhesive for circuit connection containing the curable component which consists of (a) organometallic compound, (b) thermoplastic resin, and (c) curable resin and a hardening | curing agent. The conductive adhesive for circuit connection according to the present invention is not only inexpensive by using an organometallic compound instead of insulating conductive particles, but also selectively precipitates between contacting circuit electrodes to form a uniform conductive path, while having excellent insulating properties between the other electrodes. It is suitable to be used as a conductive adhesive for inter-electrode circuit connection. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015147497-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015147495-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170081664-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140146059-A |
| priorityDate |
2010-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |