| abstract |
Its main component is epoxy resin, an insulating thermosetting resin, and contains a phenoxy resin having a molecular weight of 30000 or more, a latent curing agent, a polyvinyl butyral resin having a glass transition temperature of 100 ° C or higher, and a polyvinyl butyral resin having a glass transition temperature of 90 ° C or lower. The anisotropically conductive film 2 in which the electroconductive particle 6 was disperse | distributed in the adhesive agent 30 for electrodes connection to make a minimum pitch 150 micrometers or less, while restoring the fall of repair property, when connecting between electrodes via an anisotropically conductive film. Provided is an anisotropic conductive film having high heat resistance, which can cope with fine pitch formation by further adding an electrode. |