http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110084529-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7442b6cce4e96d3dc4a380851e9224d8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-4411 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-4484 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-02 |
| filingDate | 2009-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_525dab6508eba35d56823ed14825c08a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a288429af5ad14b7e7f0ad909733f5d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_174558f076b9a6c13bb8bcc6907c9eb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8dc58b2a089091ad16c5f8c84cf2042 |
| publicationDate | 2011-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20110084529-A |
| titleOfInvention | Post treatment method of metal layer |
| abstract | Of metal substrates containing constituent metals selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals How to treat the surface. An anode potential is applied to the metal surface in an electrolyte circuit containing an electrolyte solution in contact with the metal surface, the cathode, and the metal surface and in electrical communication with the cathode. The electrolyte solution may contain an electrolyte comprising anion of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. have. Anions may include polymers having side chain moieties selected from the group consisting of phosphates, phosphonates, phosphites, phosphinates, sulfates, sulfonates, carboxylates and combinations thereof. The potential applied to the circuit is such that the substrate is anode oxidized and reacts with the anions to form a composition that imparts improved properties to the metal surface. The pH of the electrolyte solution is below about 6.0, the applied potential is between about 0.5 to about 20 volts, and the current density is between about 0.01 and 2 amps / dm 2 per geometric surface area of the metal in contact with the electrolyte solution, It is preferred that the initial cation of the constituent metal produced by anode oxidation is adjusted to react with the anion on the metal surface, without significant formation of any oxides or hydroxides of the constituent metal. |
| priorityDate | 2008-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.