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filingDate 2009-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cc0d4cfb1474b7a6499c5bc92369c40
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publicationDate 2011-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20110083716-A
titleOfInvention Coextruded Multilayer Polyolefin-Based Backsheet for Electronic Device Module
abstract Multilayer structures useful as backsheets for electronic devices, for example photovoltaic cells, include (A) a top layer comprising a polyolefin resin, for example ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) an adhesive, For example, a first tie layer comprising ethylene glycidyl methacrylate and having an upper facial surface and a lower facial surface, the upper facial surface of which is attached in contact with the lower facial surface of the upper layer; and (C ) A lower layer comprising a polyolefin having at least one melting peak above 125 ° C., for example polypropylene, and having an upper facial layer and a lower facial surface, the upper facial surface of which is the lower facial surface of the first tie layer. In contact with the contact surface).
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