http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110082925-A

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filingDate 2010-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0b7cb3c84b68632bb83a932255d1797
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publicationDate 2011-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20110082925-A
titleOfInvention Adhesive composition for flexible circuit board reinforcement plate and adhesive sheet using same
abstract The present invention relates to an adhesive composition for a flexible circuit board reinforcement plate and an adhesive sheet using the same. More specifically, the present invention has excellent adhesion to a reinforcement plate while maintaining long-term storage like an acrylic adhesive even under soaking conditions. The present invention relates to an adhesive composition for a flexible circuit board reinforcement plate having improved heat resistance and an adhesive sheet using the same, which may correspond to a process temperature. To this end, the adhesive composition for a flexible circuit board reinforcing plate according to the present invention is a silane having an acid value of 3-30 mg KOH / g and Si content of 500-12,000 ppm obtained through the reaction of an urethane polymer having an isocyanate end group and an amine compound having a silane group. It is obtained by mixing a modified polyurethane urea resin (A) and an epoxy compound (B).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101316685-B1
priorityDate 2010-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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