| abstract |
(A) 100 parts by mass of an organopolysiloxane having two or more alkenyl groups in one molecule, (B) an organopolysiloxane having two or more silicon-bonded hydrogen atoms in one molecule, (C) hydrosilylation Reaction catalyst, (D) hydrosilylation reaction inhibitor, and (E) the components (A), (B) and (D) can be dissolved, are liquid at room temperature, and have a boiling point of 180 ° C to 400 ° C. Liquid die bonding agents comprising an organic solvent are described. In addition, the liquid die bonding agent (F) further comprises an organosilicon compound-based adhesion promoter. |