| abstract |
A method for manufacturing an electronic device, in which a first terminal of a first electronic component and a second terminal of a second electronic component are joined by soldering to electrically connect the first electronic component and the second electronic component. And arranging a resin layer having a flux action between the second terminal to obtain a laminate comprising the first electronic component, the second electronic component, and the resin layer, and the first terminal and the second terminal. There is provided a soldering bonding step of soldering and soldering, and a pressure curing step of curing the resin layer while pressing the laminate with a pressurized fluid. |