| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2467-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2300-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2369-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2451-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L53-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00 |
| filingDate |
2009-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14f703d3f2d59bde78605bfa7a8545f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4278aca0b3c9bb73f557ad3c1518193a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cfef73c1ea7d28ec63364d9c3542413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_559f15f2937fe985d6b3add34bf0da86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_986519b5a4303355f1c4444394e3a0da |
| publicationDate |
2011-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110079056-A |
| titleOfInvention |
Molded article for electronics housing and its manufacturing method |
| abstract |
The present invention (A) 30 to 70% by weight of a polycarbonate resin; (B) 20 to 50% by weight of rubber-modified vinyl copolymer resin; And (C) 5 to 40% by weight of an amorphous polyester resin; molded for a housing of an electronic device having a thickness of 0.2 to 2 mm and an apparent specific gravity of 0.8 to 2.5 g / ml. Provide molded articles. The molded article according to the invention is useful for use in electronics housing applications, in particular excellent in chemical resistance. |
| priorityDate |
2009-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |