| abstract |
The present substrate is a resin precursor selected from (A) a polybenzoxazole precursor, a polyamic acid or a combination thereof, (B) a dissolution regulator having a boiling point of 210 ° C to 400 ° C and a polarity of 1D to 4D, and (C) acid A generator, (D) a silane compound, and (E) a solvent, wherein the polybenzoxazole precursor comprises a repeating unit represented by the following formula (1) or includes all of the repeating units of the following formulas (1) and (2) And, at least one terminal portion having a thermopolymerizable functional group, the polyamic acid relates to a positive photosensitive resin composition comprising a repeating unit of the formula (50) and formula (51).n n n [Formula 1]n n n n n n n n [Formula 2]n n n n n n n n (In the above Formula 1 and Formula 2, the definition of each substituent is the same as defined in the specification.)n n n [Formula 50]n n n n n n n n [Formula 51]n n n n n n n n (In the above Formula 50 and Formula 51, the definition of each substituent is the same as defined in the specification.) |