| abstract |
PURPOSE: A positive photosensitive polyimide resin composition is provided to ensure excellent photosensitivity, resolution, insulating property, heat impact property and adhesion. CONSTITUTION: A positive photosensitive polyimide resin composition comprises (a) additives including single or two kinds or more selected from compounds represented by chemical formulas 1-4, (b) an alkali-developable polyamide resin including a structure unit represented by chemical formula 5 and a structure unit represented by chemical formula 6, (c) a photoresist including a naphthoquinone diazide-based compound, and (d) a solvent. |