| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_142d981bd6c180968f769e0da8f620da |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate |
2009-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003d6ec96cd3011d75bd6eae2a558162 |
| publicationDate |
2011-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20110060628-A |
| titleOfInvention |
Anisotropic conductive adhesive and semiconductor mounting method using the same |
| abstract |
The present invention provides a conductive particle comprising a nucleus having a conductive surface and an insulating film coated on the surface of the nucleus, an adhesive insulating resin that hardening is not completed at the melting point of the conductive surface, and curing of the adhesive insulating resin is completed. The present invention relates to an anisotropic conductive adhesive in the form of a paste or a film containing heat-dissipating particles that are not melted at a temperature that is melted, and a method for mounting a semiconductor using the same. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170084028-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103730192-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107488436-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107488436-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210138965-A |
| priorityDate |
2009-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |