patent/KR-20110058061-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110058061-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11901 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aed2712e7b950f2b802bafc629c53284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_990882bc69396cde811249f85e6a9547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fafd1761172c2bae9ad4d6b4a61351e
publicationDate	2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20110058061-A
titleOfInvention	Die Mounting Board and Manufacturing Method Thereof
abstract	The present invention relates to a die mounting substrate and a method for manufacturing the same, and includes a mounting substrate having a pad portion, a die having a terminal portion, a surface mounted on the mounting substrate, and a pad portion or the terminal portion. It characterized in that it comprises a conductive paste bump connecting the terminal portion, by mounting the die on the mounting substrate using the conductive paste bump, the shear stress is reduced to prevent the degradation of reliability due to the difference in thermal expansion coefficient between the die and the mounting substrate In addition, it is possible to prevent the problem of lowering the adhesion of the bumps due to the miniaturization of the pad part formed on the mounting substrate.n n n n Conductive Paste Bump, Mounting Board, Die, Shear Stress, Fine Pattern
priorityDate	2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23954 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557109 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

Total number of triples: 43.