abstract |
The semiconductor device 1 of the present invention includes a semiconductor element 3 provided on at least one side of the substrate 2 and the substrate 2, and between the substrate 2, the semiconductor element 3, and the semiconductor element 3. The agent obtained by hardening | curing a 2nd resin composition after hardening | curing the 1st resin 4 obtained by hardening | curing the 1st resin composition which fills the surface, and the board | substrate 2 and the 1st resin 4, and hardening 1st resin composition. It has two resins (5). In this invention, the adhesive strength of the 1st resin 4 and the 2nd resin 5 is 18 Mpa or more at room temperature. |